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Block Compressive Sensing for Solder Joint Images with Wavelet Packet Thresholding

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成果类型:
期刊论文
作者:
Zhao, Hui-Huang*;Rosin, Paul L.;Lai, Yu-Kun
通讯作者:
Zhao, Hui-Huang
作者机构:
[Zhao, Hui-Huang] Hengyang Normal Univ, Coll Comp Sci & Technol, Dept Comp Sci, Hengyang 421002, Peoples R China.
[Lai, Yu-Kun; Rosin, Paul L.] Cardiff Univ, Sch Comp Sci & Informat, Cardiff CF24 3AA, S Glam, Wales.
通讯机构:
[Zhao, Hui-Huang] H
Hengyang Normal Univ, Coll Comp Sci & Technol, Dept Comp Sci, Hengyang 421002, Peoples R China.
语种:
英文
关键词:
Block compressive sensing (CS);compressive sampling patching pursuit;greedy basis pursuit;orthogonal matching pursuit;solder joint image;subspace pursuit;wavelet packet thresholding
期刊:
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN:
1521-3331
年:
2019
卷:
9
期:
6
页码:
1190-1199
基金类别:
Manuscript received August 17, 2018; revised February 1, 2019; accepted March 4, 2019. Date of publication March 25, 2019; date of current version June 6, 2019. This work was supported in part by the National Natural Science Foundation of China under Grant 61503128, in part by the Science and Technology Plan Project of Hunan Province under Grant 2016TP1020, in part by the Scientific Research Fund of Hunan Provincial Education Department under Grant 16C0226 and Grant 18A333, in part by the Hengyang Guided Science and Technology Projects and Application-Oriented Special Disciplines under Grant Hengkefa [2018]60-31, in part by the Double First-Class University Project of Hunan Province under Grant Xiangjiaotong [2018]469, in part by the Hunan Province Special Funds of Central Government for Guiding Local Science and Technology Development under Grant 2018CT5001, and in part by the Subject Group Construction Project of Hengyang Normal University under Grant 18XKQ02. Recommended for publication by Associate Editor X. Fan upon evaluation of reviewers’ comments. (Corresponding author: Hui-Huang Zhao.) H.-H. Zhao is with the Department of Computer Science, College of Computer Science and Technology, Hengyang Normal University, Hengyang 421002, China (e-mail: happyday.huihuang@gmail.com).
机构署名:
本校为第一且通讯机构
院系归属:
计算机科学与技术学院
摘要:
This paper provides a novel method that can achieve better results in solder joint imagery compression and reconstruction. Wavelet packet decomposition is used to generate some frequency coefficients of images. The higher and lower frequency coefficients of the reconstruction signal are used separately to improve the reconstruction performance. A threshold that only relates to the higher frequency coefficients is defined to remove the noise in the reconstruction result in each iteration. A new control factor is further defined to control the th...

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