期刊论文

Zhao, Huihuang

中文

焊接学报

0253-360X

2014

35

8

30-34 and 42

国家高技术研究发展计划资助项目(863计划,2007-AA04Z244) 湖南省自然科学基金资助项目(12JJ4058) 湖南省'十二五'重点建设学科资助项目 湖南省科技厅资助项目(2010FJ4077,2013GK3064,2013GK3082)

本校为其他机构

焊点表面三维重建是微组装质量三维检测与控制技术的重点研究内容之一.焊点图像中存在的高亮区,使得微电子组装焊点表面三维重建成为难点问题.为解决此问题,通过分析焊点表面光照反射项,结合焊点图像的特点,依据光照反射原理,推导焊点表面反射光照反射模型;通过分析图像中高亮区的形成原理,提出一种改进的微组装焊点表面三维重建算法.结果表明,与基于其它传统光照反射模型的三维重建方法相比,采用提出的三维重建算法可解决微组装焊点三维重建失真问题,重建出的焊点三维形状更加理想.

Solder joint three-dimensional (3D) reconstruction is one of the key research of microelectronic assembly quality 3D detection and control technology development. During the solder joint 3D reconstruction based on SFS theory, its 3D reconstruction becomes one of the key problems because of existing “ high light area” on solder joint surface. In order to resolve the problem, at first, by analyzing the reflection items on solder joint surface, a reflection model is got for microelectronics solder joint according to the characteristics of joint ...