Solder joint quality inspection is the key technology for protecting the microelectronic assembly products quality and reliability. With the development of microelectronics assembly components, the traditional inspection way which has low accuracy and a limited detection range cannot meet the requirements of solder joint quality inspection. It is urgent to develop a high precision method for solder joint quality inspection. At first, by analyzing the features of 3D point cloud, a 3D point cloud segmentation algorithm is proposed, and solder joint surface 3D point cloud is got. Then, According ...