[Yingde Niu; Fei Gu; Jinshan Wang] School of Materials Science and Engineering, Yancheng Institute of Technology, Yancheng, 224051, PR China
[Chuang Yao] Chongqing Key Laboratory of Extraordinary Bond Engineering and Advance Materials Technology (EBEAM), Yangtze Normal University, Chongqing, 408100, PR China
[Zhixin Dai; Yanhong Deng] College of Physics and Electronics Engineering, Hengyang Normal University, Hengyang, 421002, PR China
[Jianfeng Zhang] School of Integrated Circuits, Guangdong University of Technology, Guangzhou, 510006, PR China
[Yang Jiang] School of Materials Science and Engineering, Yancheng Institute of Technology, Yancheng, 224051, PR China<&wdkj&>Chongqing Key Laboratory of Extraordinary Bond Engineering and Advance Materials Technology (EBEAM), Yangtze Normal University, Chongqing, 408100, PR China
