期刊论文、会议论文

Zhao Huihuang

英文

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)

2012

1284-1286

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))论文集

2012-08-13

桂林

[Zhao Huihuang] Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China.^[Wang Yaonan;Sun Yaqi] Hunan Univ, Dept Control Sci & Engn, Changsha 410082, Hunan, Peoples R China.

中国电子学会<&wdkj&>中国半导体行业协会

Bi, K Yang, D Cai, M

345 E 47TH ST, NEW YORK, NY 10017 USA

IEEE

978-1-4673-1681-1; 978-1-4673-1682-8

10.1109/ICEPT-HDP.2012.6474840

Natural Science Foundation of Hunan Province:" Research on 3D reconstruction of micro assembly circuit module solder joint based on double cameras "; Key Construction Disciplines of the Hunan Province during the Twelfth Five- Year Plan Period

本校为第一且通讯机构

A extraction approach is proposed based on an image processing in order to improve the accuracy of 2D quality information extraction for surface mount technology (SMT) BGA(Ball Grid Array) solder joint of chip components. First, some appropriate image processing algorithms are utilized to eliminate the noise in the solder joint image. And a binaryzation image is obtained after character. Then the BGA Solder Joint 2D quality information extraction system is developed based on Visual C++, and the 2D quality information of solder joint circumference, area, void area, and diameter, are obtained. T...