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Solder joint imagery compressing and recovery based on compressive sensing

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成果类型:
期刊论文
作者:
Zhao, Huihuang*;Wang, Yaonan;Qiao, Zhijun;Fu, Bin
通讯作者:
Zhao, Huihuang
作者机构:
[Zhao, Huihuang; Wang, Yaonan] Hunan Univ, Coll Elect & Informat Engn, Changsha 410082, Hunan, Peoples R China.
[Zhao, Huihuang] HengYang Normal Univ, Dept Comp Sci, Hengyang, Peoples R China.
[Fu, Bin; Qiao, Zhijun] Univ Texas Pan Amer, Dept Math, Edinburg, TX 78541 USA.
通讯机构:
[Zhao, Huihuang] H
Hunan Univ, Coll Elect & Informat Engn, Changsha 410082, Hunan, Peoples R China.
语种:
英文
关键词:
Assembly;Solder joints;Solder;Pin-in-paste
期刊:
Soldering & Surface Mount Technology
ISSN:
0954-0911
年:
2014
卷:
26
期:
3
页码:
129-138
基金类别:
The authors appreciate the careful comments of the anonymous reviewers. This work was supported by Key Construction Disciplines of the Hunan Province during the 12th Five-Year Plan period.
机构署名:
本校为其他机构
院系归属:
计算机科学与技术学院
摘要:
Purpose: The purpose of this paper is to develop an improved compressive sensing algorithm for solder joint imagery compressing and recovery. The improved algorithm can improve the performance in terms of peak signal to noise ratio (PSNR) of solder joint imagery recovery. Design/methodology/approach: Unlike the traditional method, at first, the image was transformed into a sparse signal by discrete cosine transform;then the solder joint image was divided into blocks, and each image block was transformed into a one-dimensional data vector. At last, a block compressive sampling matching pursuit ...

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