会议论文

Sun Yaqi

英文

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)

2012

1287-1289

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))论文集

2012-08-13

桂林

[Sun Yaqi] Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China.^[Liu Yu] GuiLin Univ Technol, Coll Mech & Control Engn, Guilin, Peoples R China.

中国电子学会<&wdkj&>中国半导体行业协会

Bi, K Yang, D Cai, M

345 E 47TH ST, NEW YORK, NY 10017 USA

IEEE

978-1-4673-1681-1; 978-1-4673-1682-8

10.1109/ICEPT-HDP.2012.6474841

Natural Foundation of Hunan Province:" Research Science on 3D reconstruction of micro assembly circuit module solder joint based on double cameras "; Key Construction Disciplines of the Hunan Province during the Twelfth Five- Year Plan Period

本校为第一且通讯机构

Research on SMT solder joint image segmentation can formed feedback information of the products assembly which is used to control and adjust the SMT assembly, and is useful to guide SMT to improve the quality and process of SMT products. In our study, we improve a novel approach of SMT solder joint image segmentation. During our method, the process has three steps. At first, the RGB image of solder joint is converted into HSV image. Second, we segment the solder joint by color domain 2D histogram threshold. Last, mathematics morphology processing is used to improve the segment accuracy. Experi...