期刊：
Applied Mechanics and Materials,2012年157-158:1008-1011 ISSN：1660-9336
通讯作者：
Zhao, Huihuang
作者机构：
[Chen, Jianzhen; Zhao, Huihuang; Sun, Yaqi] Hengyang Normal Univ, Dept Comp, Hengyang 421008, Hunan, Peoples R China.;[Zhao, Huihuang; Wang, Yaonan] Hunan Univ, Dept Control Sci & Engn, Changsha 410082, Hunan, Peoples R China.
通讯机构：
[Zhao, Huihuang] H;Hengyang Normal Univ, Dept Comp, Hengyang 421008, Hunan, Peoples R China.
会议名称：
2011 International Conference on Mechatronics and Applied Mechanics(2011年机电一体化与应用力学国际会议 ICMAM 2011)
会议时间：
2011-12-27
会议地点：
香港
会议主办单位：
[Zhao, Huihuang;Sun, Yaqi;Chen, Jianzhen] Hengyang Normal Univ, Dept Comp, Hengyang 421008, Hunan, Peoples R China.^[Zhao, Huihuang;Wang, Yaonan] Hunan Univ, Dept Control Sci & Engn, Changsha 410082, Hunan, Peoples R China.
会议论文集名称：
2011 International Conference on Mechatronics and Applied Mechanics(2011年机电一体化与应用力学国际会议 ICMAM 2011)论文集
关键词：
Human face;Three-dimensional reconstruction;Shape from shading;Wavelet packet transform
摘要：
Human face three-dimensional (3D) reconstruction is a challenging problem. In this paper, we propose a human face fast- 3D- reconstruction method based on image processing with a single image. Shape from shading (SFS) is chosen to reconstruct the human face. First, SFS theory is introduced. It has the advantage of fast 3D reconstruction and only need a single image. Secondly, because the noise will affect the 3D reconstruction result greatly, wavelet transform and wavelet packet transform are introduced and used in image denoising respectively. The experiment has shown that the method based on wavelet transform produces the best denoising result than wavelet packet transform. At last, a human face 3D reconstruction algorithm based on a single image is proposed. The experimental results show that a human face 3D model can be reconstructed in fast by proposed algorithm.
作者机构：
[Sun Yaqi] Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China.;[Liu Yu] GuiLin Univ Technol, Coll Mech & Control Engn, Guilin, Peoples R China.
会议名称：
2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))
会议时间：
2012-08-13
会议地点：
桂林
会议主办单位：
[Sun Yaqi] Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China.^[Liu Yu] GuiLin Univ Technol, Coll Mech & Control Engn, Guilin, Peoples R China.
会议论文集名称：
2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))论文集
摘要：
Research on SMT solder joint image segmentation can formed feedback information of the products assembly which is used to control and adjust the SMT assembly, and is useful to guide SMT to improve the quality and process of SMT products. In our study, we improve a novel approach of SMT solder joint image segmentation. During our method, the process has three steps. At first, the RGB image of solder joint is converted into HSV image. Second, we segment the solder joint by color domain 2D histogram threshold. Last, mathematics morphology processing is used to improve the segment accuracy. Experimental results show that the proposed method retains the structure of the solder joint images leading to an effective segmentation.
期刊：
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012),2012年:1284-1286
通讯作者：
Zhao Huihuang
作者机构：
[Zhao Huihuang] Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China.;[Sun Yaqi; Wang Yaonan] Hunan Univ, Dept Control Sci & Engn, Changsha 410082, Hunan, Peoples R China.
通讯机构：
[Zhao Huihuang] H;Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China.
会议名称：
2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))
会议时间：
2012-08-13
会议地点：
桂林
会议主办单位：
[Zhao Huihuang] Hengyang Normal Univ, Dept Comp Sci, Hengyang 421008, Hunan, Peoples R China.^[Wang Yaonan;Sun Yaqi] Hunan Univ, Dept Control Sci & Engn, Changsha 410082, Hunan, Peoples R China.
会议论文集名称：
2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))论文集
摘要：
A extraction approach is proposed based on an image processing in order to improve the accuracy of 2D quality information extraction for surface mount technology (SMT) BGA(Ball Grid Array) solder joint of chip components. First, some appropriate image processing algorithms are utilized to eliminate the noise in the solder joint image. And a binaryzation image is obtained after character. Then the BGA Solder Joint 2D quality information extraction system is developed based on Visual C++, and the 2D quality information of solder joint circumference, area, void area, and diameter, are obtained. The experimental results have illustrated that the system can accomplish a good extraction result.
